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UPG2035T5F
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered and mounted under the following recommended conditions. For soldering
methods and conditions other than those recommended below, contact your nearby sales of?ce.
Soldering Method
Soldering Conditions
Condition Symbol
Infrared Re?ow
Wave Soldering
Partial Heating
Peak temperature (package surface temperature)
Time at peak temperature
Time at temperature of 220 ° C or higher
Preheating time at 120 to 180 ° C
Maximum number of re?ow processes
Maximum chlorine content of rosin ?ux (% mass)
Peak temperature (molten solder temperature)
Time at peak temperature
Preheating temperature (package surface temperature)
Maximum number of ?ow processes
Maximum chlorine content of rosin ?ux (% mass)
Peak temperature (pin temperature)
Soldering time (per side of device)
Maximum chlorine content of rosin ?ux (% mass)
: 260 ° C or below
: 10 seconds or less
: 60 seconds or less
: 120 ± 30 seconds
: 3 times
: 0.2%(Wt.) or below
: 260 ° C or below
: 10 seconds or less
: 120 ° C or below
: 1 time
: 0.2%(Wt.) or below
: 350 ° C or below
: 3 seconds or less
: 0.2%(Wt.) or below
IR260
WS260
HS350
Caution
Do not use different soldering methods together (except for partial heating).
Life Support Applications
These NEC products are not intended for use in life support devices, appliances, or systems where the malfunction of these products can reasonably
be expected to result in personal injury. The customers of CEL using or selling these products for use in such applications do so at their own risk and
agree to fully indemnify CEL for all damages resulting from such improper use or sale.
05/04/2005
A Business Partner of NEC Compound Semiconductor Devices, Ltd.
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